Description
Lenovo ThinkSystem SR630 V2 Rack Server [7Z71A018AU]
Intel Xeon Silver 4309Y, 16GB TruDDR4 3200MHz RDIMM, 750W Power Supply, 3 year warranty
Built for business, with business-critical versatility
Confidently deploy performance-driven, industry-leading in reliability and security enhanced SR630 V2 for cloud, analytics, virtualization or gaming.
Quick Spec
Components | Specification |
Processor/Speed | Intel Xeon Silver 4309Y 2.8GHz |
Processor Cores | 8 Cores |
Memory |
1x16GB installed (up to 8TB by using 32x 256GB 3DS RDIMMs) |
Drive Bays/Drives | Option 2.5"; Open bay |
Maximum internal storage |
|
RAID Controller | Option |
Power Supply | 1x750W installed, up to two hot-swap redundant AC power supplies |
Form factor | 1U rack |
Operating systems supported | Microsoft Windows Server, Red Hat Enterprise Linux, VMware ESXi. See the Operating system support section for specifics. |
Limited warranty | Three-year or one-year (model dependent) customer-replaceable unit and onsite limited warranty with 9x5 next business day (NBD). |
Future defined data center
Lenovo delivers engineered, tested and certified IT solutions that are high performance, scalable and cost-effective. By combining industry-leading x86 server technology and reliability, partnering to deliver best-in class co-innovation and providing end-to-end peace of mind with Lenovo ThinkShield, XClarity, and Services, Lenovo solutions enable customers to use real-time data to drive actionable insights. As the compute for these solutions, ThinkSystem SR630 V2 makes businesses smarter by providing support for data analytics, hybrid cloud, hyperconverged infrastructure, video surveillance, high performance computing and much more.
Workload-optimized support
ThinkSystem SR630 V2 is tuned for Intel® Optane™ Persistent Memory 200 series. With this second generation of high performing persistent memory tier optimized for 3rd generation Intel® Xeon® Scalable processors, it offers significantly lower data latency, higher capacities and greater value. With data stored closer to the processor, applications can access data faster driving swifter response times for real-time analytics, financial transactions, electronic medical records, fraud detection, and much more.
Flexible storage
Industry leading backplane design for Lenovo AnyBay™ features a choice of drive interface type in the same drive bay: SAS drives, SATA drives, U.2 & U.3 NVMe PCIe drives, or EDSFF-based SSDs. Freedom to configure some of the bays with PCIe SSDs and still use the remaining bays for capacity SAS drives provides the ability to upgrade to more PCIe SSDs in the future as needed.
Specifications
Components | Specification |
Intel Xeon Processor | 1x Silver 4309Y 8C 105W 2.8G |
Memory | 1x 16GB |
RAID | 9350-8i |
Drive bays | 8x 2.5" SAS; Open bay |
Power supply | 1x750W |
Machine types | 7Z71 - 3 year warranty |
Form factor | 1U rack. |
Processor | One or two third-generation Intel Xeon Scalable processor (formerly codenamed "Ice Lake"). Supports processors up to 40 cores, core speeds of up to 3.6 GHz, and TDP ratings of up to 270W. |
Chipset | Intel C621A "Lewisburg" chipset, part of the platform codenamed "Whitley" |
Memory | 16GB TruDDR4 3200MHz RDIMM |
Persistent memory | Supports up to 16x Intel Optane Persistent Memory 200 Series modules (8 per processor) installed in the DIMM slots. Persistent memory (Pmem) is installed in combination with system memory DIMMs. |
Memory maximum | With RDIMMs: Up to 8TB by using 32x 256GB 3DS RDIMMs |
With Persistent Memory: Up to 12TB by using 16x 256GB 3DS RDIMMs and 16x 512GB Pmem modules | |
Memory protection | ECC, SDDC (for x4-based memory DIMMs), ADDDC (for x4-based memory DIMMs, requires Platinum or Gold processors), and memory mirroring. |
Disk drive bays | Up to 4x 3.5-inch or 12x 2.5-inch or 16x EDSFF hot-swap drive bays: |
Front bays can be one of the following: | |
10x 2.5-inch hot-swap: All AnyBay | |
10x 2.5-inch hot-swap: All NVMe | |
10x 2.5-inch hot-swap: 6x SAS/SATA + 4x AnyBay | |
10x 2.5-inch hot-swap: 6x SAS/SATA + 4x NVMe | |
10x 2.5-inch hot-swap: 6x SAS/SATA + 2x AnyBay + 2x NVMe | |
8x 2.5-inch hot-swap SAS/SATA | |
16x EDSFF E1.S form factor hot-swap drives | |
4x 3.5-inch hot-swap SAS/SATA | |
4x 3.5-inch hot-swap AnyBay | |
Rear can be one of the following: | |
2x 2.5-inch hot-swap SAS/SATA bays | |
2x 2.5-inch hot-swap NVMe bays | |
2x 7mm 2.5-inch hot-swap SATA bays | |
2x 7mm 2.5-inch hot-swap NVMe bays | |
Internal M.2 module supporting up to two M.2 drives, for OS boot and drive storage support | |
See Supported drive bay combinations for details. AnyBay bays support SAS, SATA or NVMe drives. NVMe bays only support NVMe drives. Rear drive bays can be used in conjunction with 2.5-inch front drive bays. The server supports up to 12x NVMe drives all with direct connections (no oversubscription). | |
Maximum internal storage | 2.5-inch drives: |
368.64TB using 12x 30.72TB 2.5-inch SAS/SATA SSDs | |
368.64TB using 12x 30.72TB 2.5-inch NVMe SSDs | |
28.8TB using 12x 2.4TB 2.5-inch HDDs | |
EDSFF drives | |
122.88TB using 16x 7.68TB EDSFF NVMe SSDs | |
3.5-inch drives: | |
88TB using 4x 22TB 3.5-inch HDDs | |
61.44TB using 4x 15.36TB 3.5-inch SAS/SATA SSDs | |
51.2TB using 4x 12.8TB 3.5-inch NVMe SSDs | |
Raid Controller Options: |
|
Optical drive bays | No internal optical drive. |
Tape drive bays | No internal backup drive. |
Network interfaces | Dedicated OCP 3.0 SFF slot with PCIe 4.0 x16 host interface. Supports a variety of 2-port and 4-port adapters with 1GbE, 10GbE and 25GbE network connectivity. One port can optionally be shared with the XClarity Controller (XCC) management processor for Wake-on-LAN and NC-SI support. |
PCI Expansion slots | Up to 3x PCIe 4.0 slots, all with rear access, plus a slot dedicated to the OCP adapter. Slot availability is based on riser selection and rear drive bay selection. Slot 3 requires two processors. |
Four choices for rear-access slots: | |
3x PCIe 4.0 x16 low-profile slots | |
1x PCIe 4.0 x16 full-height half-length slot + 1x PCIe 4.0 x16 low-profile slot | |
GPU support | Supports up to 3x single-wide GPUs |
Ports |
Front: 1x USB 3.2 G1 (5 Gb/s) port, 1x USB 2.0 port (also for XCC local management), External diagnostics port, optional VGA port. Rear: 3x USB 3.2 G1 (5 Gb/s) ports, 1x VGA video port, 1x RJ-45 1GbE systems management port for XCC remote management. Optional DB-9 COM serial port (installs in slot 3). Internal: 1x USB 3.2 G1 connector for operating system or license key purposes |
Cooling | Up to 8x N+1 dual-rotor redundant hot-swap 40 mm fans, configuration dependent. One fan integrated in each power supply. |
Power supply | 750W |
Video | G200 graphics with 16 MB memory with 2D hardware accelerator, integrated into the XClarity Controller. Maximum resolution is 1920x1200 32bpp at 60Hz. |
Hot-swap parts | Drives, power supplies, and fans. |
Systems management | Operator panel with status LEDs. Optional External Diagnostics Handset with LCD display. Models with 8x 2.5-inch front drive bays can optionally support an Integrated Diagnostics Panel. XClarity Controller (XCC) embedded management, XClarity Administrator centralized infrastructure delivery, XClarity Integrator plugins, and XClarity Energy Manager centralized server power management. Optional XClarity Controller Advanced and Enterprise to enable remote control functions. |
Security features | Chassis intrusion switch, Power-on password, administrator's password, Trusted Platform Module (TPM), supporting TPM 2.0. In China only, optional Nationz TPM 2.0. Optional lockable front security bezel. |
Operating systems supported | Microsoft Windows Server, Red Hat Enterprise Linux, SUSE Linux Enterprise Server, VMware ESXi. See the Operating system support section for specifics. |
Limited warranty | Three-year or one-year (model dependent) customer-replaceable unit and onsite limited warranty with 9x5 next business day (NBD). |
Service and support | Optional service upgrades are available through Lenovo Services: 4-hour or 2-hour response time, 6-hour fix time, 1-year or 2-year warranty extension, software support for Lenovo hardware and some third-party applications. |
Dimensions | Width: 440 mm (17.3 in.), height: 43 mm (1.7 in.), depth: 773 mm (30.4 in.). See Physical and electrical specifications for de |